Invitation à Sensor + Test 2019 du 25 au 27 juin à Nurenberg

"Manufacturing of high precision unconventional microparts“
The power of innovation by electrochemical technologies for futuristic applications

Connectors – micro coils – micro robots – micro sensors 
 We are pleased to invite you and your team to visit us at our booth 5-133 in hall 5 on the upcoming trade show Sensor + Test from June 25th to 27th. Among others you can discover more specifically our know-how on electroforming. The UV-LIGA-Microelectroforming is an additive process applied at Steiger for over 15 years in the watch industry.

Many other applications in different R & D industry areas are possible. Is there one in your field? To find out, visit us for personalized advice. 

Your advantages

Design freedom
Multifunction in one part
Short lead-times
Low surface roughness (Ra <20 nm)
Small form and position tolerances
Low tooling costs
From prototypes to high volumes
Multi-level components 

We are looking forward to welcome you.
Best Regards,

Samuel Estoppey

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